UNF Rates & Costs

All tariffs are in NIS/hour, and don't include VAT and consumables (wafers, Au & Pd targets etc.)

Independent usage of equipment will be allowed after training and approval exam by the UNF staff. Tariffs for regular work hours (9 am-5 pm)

Technical assistance will be provided by the UNF scientific / technical staff only

For HUJI independent use from 5:00 p.m - 8:00 a.m- 50% discount

UNF Equipment/ Technique

Independent User

Technical Assist.

Clean Room

25

50

Elionix

110

220

AML Wafer Bonding System

110

220

Mask Aligner

55

110

Miscellaneous

0

110

Laser Writer

55

110

Dicing

-

300

Probe Station

55

110

Profilometer

55

110

Optical Profilometer

55

110

Electroplating

55

110

Ellipsometer

55

110

RGA System

55

110

Polymers Work Bench

55

110

Acids Hood

55

110

EDC Spinner Hood

55

110

ALD

110

220

Dektak XT/Dektak 150

55

110

Glove Box

55

110

RTA

55

110

Plasma Asher

55

110

Tube Furnaces

55

110

Glove Box Evaporator

110

220

Evaporator

110

220

Angstrom Quantum Series Evaporator

110

220

FHR Sputtering system

110

220

AJA Sputtering System

110

220

Plasma Sripper

55

110

Tube Furnaces

55

110

Wire Bonder Ball

55

110

Wire Bonder Wedge

55

110

ICPRIE OXFORD

110

220

ICPRIE CORAL

110

220

Oxford PECVD

110

220

Hall Effect System

55

110

TableTop SEM

55

110

UNF Equipment/ Technique

Independent User

Technical Assist.

Clean Room

50

50

Elionix

220

440

AML Wafer Bonding System

220

440

Mask Aligner

110

220

Miscellaneous

0

220

Laser Writer

110

220

Dicing

-

500

Probe Station

110

220

Profilometer

85

170

Optical Profilometer

110

220

Electroplating

110

220

Ellipsometer

110

220

RGA System

110

220

Polymers Work Bench

110

220

Acids Hood

110

220

EDC Spinner Hood

110

220

ALD

220

440

Dektak XT/Dektak 150

85

170

Glove Box

110

220

RTA

110

220

Plasma Asher

110

220

Tube Furnaces

110

220

Glove Box Evaporator

220

440

Evaporator

220

440

Angstrom Quantum Series Evaporator

220

440

FHR Sputtering System

220

440

AJA Sputtering System

220

440

Plasma Sripper

110

220

Tube Furnaces

110

220

Wire Bonder Ball

110

220

Wire Bonder Wedge

85

170

ICPRIE OXFORD

220

440

ICPRIE CORAL

220

440

Oxford PECVD

220

440

Hall Effect System

110

220

TableTop SEM

110

220

UNF Equipment/ Technique

Independent User

Technical Assist.

Clean Room

75

75

Elionix

330

660

AML Wafer Bonding System

330

660

Mask Aligner

165

330

Miscellaneous

0

330

Laser Writer

165

330

Dicing

-

750

Probe Station

165

330

Profilometer

110

220

Optical Profilometer

165

330

Electroplating

165

330

Ellipsometer

165

330

RGA System

165

330

Polymers Work Bench

165

330

Acids Hood

165

330

EDC Spinner Hood

165

330

ALD

330

660

Dektak XT/Dektak 150

110

220

Glove Box

165

330

RTA

165

330

Plasma Asher

165

330

Tube Furnaces

165

330

Glove Box Evaporator

330

660

Evaporator

330

660

Angstrom Quantum Series Evaporator

330

660

FHR Sputtering System

330

660

AJA Sputtering System

330

660

Plasma Sripper

165

330

Tube Furnaces

165

330

Wire Bonder Ball

165

330

Wire Bonder Wedge

110

220

ICPRIE OXFORD

330

660

ICPRIE CORAL

330

660

Oxford PECVD

330

660

Hall Effect System

165

330

TableTop SEM

165

330