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UHV Sputtering System | Center for Nanoscience and Nanotechnology

UHV Sputtering System

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Manufacturer and model:

AJA, ATC Polaris Series

General Information:

UHV Sputtering Layer Deposition 

Key Features:

  • 11 Sputtering Sources
  • 2" Magnetron Sources
  • Load-lock for 10 samples
  • Sample size: up to 100mm diameter
  • Base Pressure: 3 x 10-9 Torr (TMP + Cryo)
  • RF and DC Power Sources
  • Co-sputtering Capability
  • Reactive Sputtering (N2 and O2)
  • No Sample Cooling
  • Sample Heating up to 1,000°C
  • In-situ RGA Probe

Applications:

Deposition of high quality metallic and dieletric materials

Materials:

Al, Cu, Ti, Co, Ni, Fe, Pt, Pd, Au, Ta, Ru, Nb, Mg, Al2O3, Ni/Fe, Co/Fe, Co/Fe/B

Manufacturer Website

Start of Operation Date:

Jan 2021