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Manufacturer and model:
FHR, FHR - MS 75 x 4 - L
General Information:
Sputtering Layer Deposition
Key Features:
- Four Sputtering Sources
- 3" Magnetron Sources
- Load-lock
- Base Pressure: 3 x 10-7 Torr (TMP)
- RF and DC Power Sources
- Sample Cooling @ 17°C
Applications:
- Deposition of metallic and dieletric materials
Materials:
Ag, Al, Au, Cu, Cr, ITO, Mo, Ni, Ni/Cr, SiO2, Si3N4, Si, Ti, W, Pt, Ta, Er2O3
Start of Operation Date:
Jan 2003