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Manufacturer and model:
Oxford Plasma Instruments | Plasma Lab 100
General Information:
Plasma Enhanced Chemical Vapor Deposition of Dielectric Materials
Key Features:
- Wafers up to 150mm diameter
- load-lock operation
- end-point detector
- growth of low stress layers based on LF/HF generators
Applications:
Deposition of conformal layers of dielectric materials from nanometers to microns thickness
Materials:
SiO2, Si3N4, a-Si, SiC + dopping (Ge, P, B, H2)
Start of Operation Date:
2009