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Manufacturer and model:
Dicing System, ADT, Provectus 7100
General Information:
Dicing of Wafers
Key Features:
High precision dicing system for wafers up to 200mm diameter and 1mm thickness
Applications:
Dicing of several kinds of wafers
Materials:
Silicon, Glass, Quartz, Pyrex, Alumina, Sapphire, LiNbO3, Glassy Carbon, etc
Start of Operation Date:
August 2009