Manufacturer and model:

AML Wafer Bonder System, model AWB04,

General Information:

The only on the market capable of in-situ alignment, activation, and bonding. It allows in-situ alignment (including IR alignment) with 1µm accuracy on samples in the same chamber where bonding is performed.

Key Features:

• Unique In-situ alignment system (X,Y,Z & θ) 
• Small chips, 2”, 3” and 4” wafers (with possibility for also 6” wafers) 
• High Accuracy Optical Alignment even for small wafers sizes and chips 
• 1 to 5µm Alignment Resolution
• Automatic Process 
• Application of High Voltage, up to 2.5kV 
• Platen temperatures up to 560°C 
• Compression Forces up to 40,000N 
• Typical Force Uniformity (pressure) better than +/-10% typical (5% over specific ranges), 2-sigma value
• Self-contained, Dry Vacuum Pumping System: vacuum down to 10-6 mbar range 
• Plasma Assisted Process Capability
• Reactive Bonding Capability (H2O, N2/H2)
• Large Platen Separation (30mm) 
• Forced Nitrogen Cooling 
• Motorized chamber opening 

Applications:

MEMS, MOEMS, Complex Packaging, 3D chip stacking and Silicon-on-Insulator (SOI) platforms but not only, because its broad list of specifications gives margin to many undreamed applications: anodic bonding, direct bonding, eutectic bonding, thermal pressing on materials like Pyrex, Silicon, GaAs and more

Materials:

Pyrex, Silicon, GaAs

Manufacturer Website

Start of Operation Date:

May 2021