back to UNF devices & tools >>
Manufacturer and model:
Aligner Wafer Bonder System AML AWB04
General Information:
Bonding of wafers using thermocompression and anodic bonding methods
Key Features:
- Unique in-situ alignment capabilities
- Wafers from 3" to 6" and also small pieces
- 1 to 5µm alignment accuracy
- Application of High Voltage up to 2.5kV
- Platen Temperatures up to 560°C
- Compression Forces up to 40,000N
- Operation under vacuum down to 2x10-6 mBar
- Bonding under reactive gases like N2/H2 mixture
Applications:
- Bonding of wafers of same material
- Bonding of wafers made of different materials
- Bonding of samples using micrometer alignment
Materials:
Si, SiO2, Si covered with metals, others
Start of Operation Date:
December 2020