All usage costs are in NIS/hour, and don't include VAT and consumables (wafers, Au & Pd targets etc.)
Independent usage of equipment will be allowed after training and approval exam by the UNF staff.
Work hours:
Sunday ,Tuesday, Thursday: 8:00-17:00
Monday, Wednesday: 8:00-20:00
Technical assistance will be provided by the UNF scientific / technical staff only
* On May 2024 the usage costs will be updated at a rate of about 5%
Clean Room
25
50
Elionix
110
220
AML Wafer Bonding System
110
220
Mask Aligner
55
110
Miscellaneous
0
110
Laser Writer
55
110
Dicing
-
250
Probe Station
55
110
Profilometer
55
110
Optical Profilometer
55
110
Electroplating
55
110
Ellipsometer
55
110
RGA System
55
110
Polymers Work Bench
55
110
Acids Hood
55
110
EDC Spinner Hood
55
110
ALD
110
220
Dektak XT/Dektak 150
55
110
Glove Box
55
110
RTA
55
110
Plasma Asher
55
110
Tube Furnaces
55
110
Glove Box Evaporator
110
220
Evaporator
110
220
Angstrom Quantum Series Evaporator
110
220
FHR Sputtering system
110
220
AJA Sputtering System
110
220
Plasma Sripper
55
110
Tube Furnaces
55
110
Wire Bonder Ball
55
110
Wire Bonder Wedge
55
110
ICPRIE OXFORD
110
220
ICPRIE CORAL
110
220
Oxford PECVD
110
220
Hall Effect System
55
110
TableTop SEM
55
110
Milling System
110
220
Clean Room
50
50
Elionix
220
440
AML Wafer Bonding System
220
440
Mask Aligner
110
220
Miscellaneous
0
220
Laser Writer
110
220
Dicing
-
500
Probe Station
110
220
Profilometer
110
220
Optical Profilometer
110
220
Electroplating
110
220
Ellipsometer
110
220
RGA System
110
220
Polymers Work Bench
110
220
Acids Hood
110
220
EDC Spinner Hood
110
220
ALD
220
440
Dektak XT/Dektak 150
110
220
Glove Box
110
220
RTA
110
220
Plasma Asher
110
220
Tube Furnaces
110
220
Glove Box Evaporator
220
440
Evaporator
220
440
Angstrom Quantum Series Evaporator
220
440
FHR Sputtering System
220
440
AJA Sputtering System
220
440
Plasma Sripper
110
220
Tube Furnaces
110
220
Wire Bonder Ball
110
220
Wire Bonder Wedge
110
220
ICPRIE OXFORD
220
440
ICPRIE CORAL
220
440
Oxford PECVD
220
440
Hall Effect System
110
220
TableTop SEM
110
220
Milling System
220
440
Clean Room
75
75
Elionix
330
660
AML Wafer Bonding System
330
660
Mask Aligner
165
330
Miscellaneous
0
330
Laser Writer
165
330
Dicing
-
750
Probe Station
165
330
Profilometer
165
330
Optical Profilometer
165
330
Electroplating
165
330
Ellipsometer
165
330
RGA System
165
330
Polymers Work Bench
165
330
Acids Hood
165
330
EDC Spinner Hood
165
330
ALD
330
660
Dektak XT/Dektak 150
165
330
Glove Box
165
330
RTA
165
330
Plasma Asher
165
330
Tube Furnaces
165
330
Glove Box Evaporator
330
660
Evaporator
330
660
Angstrom Quantum Series Evaporator
330
660
FHR Sputtering System
330
660
AJA Sputtering System
330
660
Plasma Sripper
165
330
Tube Furnaces
165
330
Wire Bonder Ball
165
330
Wire Bonder Wedge
165
330
ICPRIE OXFORD
330
660
ICPRIE CORAL
330
660
Oxford PECVD
330
660
Hall Effect System
165
330
TableTop SEM
165
330
Milling System
330
660
