Sputtering System

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Manufacturer and model:

FHR, FHR - MS 75 x 4 - L

General Information:

Sputtering Layer Deposition 

Key Features:

  • Four Sputtering Sources
  • 3" Magnetron Sources
  • Load-lock
  • Base Pressure: 3 x 10-7 Torr (TMP)
  • RF and DC Power Sources
  • Sample Cooling @ 17°C

Applications:

  • Deposition of metallic and dieletric materials

Materials:

Ag, Al, Au, Cu, Cr, ITO, Mo, Ni, Ni/Cr, SiO2, Si3N4, Si, Ti, W, Pt, Ta, Er2O3

Manufacturer Website

Start of Operation Date:

Jan 2003