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Manufacturer and model:

Oxford Plasma Instruments 
Plasma Lab 100 

General Information:

 High-performance dry etching of a large range of materials

Key Features:

• Wafers up to 150mm diameter
  load-lock operation
  end-point detector
  Chlorine and Fluorine Chemistry

Applications:

• Deposition of conformal layers of dielectric materials from nanometers to microns thickness

Materials:

Si, SiO2, Si3N4, Sapphire, GaAs, InP, GaN, Al, Nb, ITO, Polymers

Manufacturer Website

Start of Operation Date:

2009