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HOME / LINKS / PACKAGING PROCESS / Dicing System

Dicing System

Dicing of Wafers

Yakov Lifeman | 054-3116636 | life6045@012.net.il

https://nano.huji.ac.il/dicing-system

Mailing address

The Hebrew University of Jerusalem
The Harvey M. Krueger Family Center
for Nanoscience and Nanotechnology
Edmond J. Safra Campus
Jerusalem 9190401, Israel

contact us

+972-2-6586088
+972-2-6584919
HUJ-NANO@savion.huji.ac.il

3D Printing Center

+972-2-6585719
huji3dpc@mail.huji.ac.il
Fax: +972-2-6584340

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