Hesham Taha
CEO and Co-Founder Teramount
In the rapidly evolving landscape of artificial intelligence (AI) and machine learning (ML), the demand for high-speed, low-latency, and low-power data transfer is crucial. Optical connectivity stands out, offering superior bandwidth and efficiency compared to traditional copper connectivity. This talk explores the potential of different optical connectivity technologies in enhancing AI and ML, especially in data centers and in advanced computing clusters.
The talk’s focus will be on Teramount's innovative "self-aligning optics" technology, which utilizes wafer-level optics processes to integrate optical coupling elements with standard semiconductor manufacturing flow and processes. This technology significantly advances fiber coupling to silicon photonics chips, solving the chip-to-chip I/O connectivity challenge and allows for seamless integration of photonics with 2.5/3D advanced semiconductor packaging architectures.
By aligning optical packaging with semiconductor standards, Teramount's technology boosts the performance and scalability of silicon photonics while ensuring manufacturing compatibility. Join us to delve into how these innovations are poised to revolutionize data transfer infrastructure, paving the way for unprecedented advancements in AI and ML capabilities.