THE HEBREW UNIVERSITY CENTER FOR NANOSCIENCE AND NANOTECHNOLOGY

Wire Bonder


Manufacturer and model: Kulicke @ Soffa Wedge bonder 4523
  • Microprocessor controlled bonding cycle and bonding parameter(s) application.
  • Independent Manual Z axis control, separate from X and Y axis control.
  • Independently adjustable Wire Parameters: - Separate Force control for each bond, adjustable and independent per channel. - Separate Bond Time control for each bond. - Separate Bond Power control for each bond.
  • No springs are used to apply bond force; digitally controlled components are utilized.
  • Standard bonding , Deep Access and Ribbon bonding with same Bond Head "tool assembly". No need to change "tool assembly"
  • Motorized Wire Clamp Motion with Linear Stepper Motor.
  • Wire Sizes are from .0007" dia., to .003" dia. (18 - 75 Micron Diameter) Aluminum and Gold.
  • Ribbon Sizes are up to .001" x .010" (gold).
For More Information:
http://www.kns.com/KNS07/Templates/showpage.asp?DBID=1&LNGID=1&TMID=87&FID=517&PID=1406