Manufacturer and model: Veeco Dektak 150
NEW CAPABILITIES FOR MORE APPLICATIONS:
Veeco's newest stylus profiler system is available with three configurations to permit the best possible match to your research or industry application. The standard Dektak 150 utilizes a new-design, 4 x 4-inch X-Y stage with manual theta.
LARGER SAMPLES AND LONGER SCANS:
The innovative design of the Dektak 150 accommodates samples up to 3-inches thick, performs long scans of 55 millimeters and provides a larger X-Y translation than competing systems. With the scan-stitching package, the system can perform even longer scans for stress measurements on larger wafers. Other stage features include wafer alignment pins for ease of use, three-point suspension for stress, lateral calibration for 99.9% accuracy, and a larger scan block for improved baseline stability.
With 6-angstrom step-height repeatability, the Dektak 150 profiler provides the flexibility to perform precise step-height measurements for thin films down to less than 100 angstroms,as well as thick-film measurements up to several hundred microns thick. The Low-Inertia Sensor 3 (LIS 3) head incorporates key technology advances to deliver very accurate measurements with high sensitivity.
LARGER VERTICAL RANGE
The 512-micron vertical range is the best standard Z performance in the industry, and a 1-millimeter option extends the vertical range of these systems even further. The result of all these features is exceptional horizontal and vertical resolution, enabling precise planarity scans for measuring radius of curvature, flatness, and waviness, as well as characterizing thin-film stress on wafers.
POWERFUL, EASY-TO-USE SOFTWARE
The Windows® XP software interface allows the operator to quickly become a Dektak 150 expert. Analysis functions are both comprehensive and intuitive, from simple one-button load-and-go testing to automatic comparisons of analytical results from multiple scans. The Vision® analysis package further extends the usefulness of the Dektak 150 data, enabling true 3D mapping, bearing ratio, and over 200 additional analyses.
MICROFORM MEASUREMENTS, LOWEST STYLUS FORCE
The new MicroFormTM package reveals difficult shapes and overcomes steep slopes, improving accuracy to within 0.25°. Similarly, the Low-Force option improves stylus sensitivity to 0.03 milligrams to enable non-destructive characterization of delicate surfaces. Plus, additional analysis capabilities have been added, such as histogram and advanced automation program summary for pass/fail analysis.